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WSON6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100.

• Normal 3.267371e-13 -1.000000e+00 -1.906464e-14.
• -5.00013 7.48323 0 vertex.

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