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Strip, HLE-106-02-xxx-DV-BE-A, 6 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Molex Pico-SPOX Connector System, 53048-1410, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Inductor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator LED SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 38 Pin (http://www.ti.com/lit/ds/symlink/tlc5951.pdf#page=47&zoom=140,-67,15), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=295), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 With STLink ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf WSON, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2018-6.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 28 Pin (http://www.ti.com/lit/ds/symlink/lm5175.pdf#page=40), generated with kicad-footprint-generator JST ZE series connector, B10B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-50S-0.5SH, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, BM14B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex PicoBlade top entry Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-115-02-xx-DV-TE, 15 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0310, with PCB locator, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-111-02-xxx-DV-BE, 11 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20%20Lead%20VQFN%203x3x0_9mm_1_7EP%20U2B%20C04-21496a.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-10DS-0.5V, 10 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-2000 (alternative finishes: 43045-182x), 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 84 pins, through hole 3.3mm, height 12, Wuerth electronics 9775096360 (https://katalog.we-online.com/em/datasheet/9775096360.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Tactile Switch SPST Slide 8.61mm 338mil SMD SMD 12x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils SMD DIP DIL PDIP 2.54mm 7.62mm.

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