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Connector, B9PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, BM04B-ACHSS-A-GAN-ETF (http://www.jst-mfg.com/product/pdf/eng/eACH.pdf), generated with kicad-footprint-generator Wuerth WR-WTB series connector, B3P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-135-02-xxx-DV-BE-LC, 35 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-137-02-xxx-DV, 37 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 2, Wuerth electronics 9776090960 (https://katalog.we-online.com/em/datasheet/9776090960.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py EQFP, 144 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-20DP-0.5V, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 14 Pin (http://www.st.com/resource/en/datasheet/lis2dh.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 30 Pin (JEDEC MO-153 Var JA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST PH series connector, B13B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 3, Wuerth electronics 9774080951 (https://katalog.we-online.de/em/datasheet/9774080951.pdf), generated with kicad-footprint-generator Resistor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.susumu.co.jp/common/pdf/n_catalog_partition07_en.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0280, 28 Circuits (https://www.molex.com/pdm_docs/sd/2005280280_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, 501331-0307 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf TDFN, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 43915-xx08, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23.

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