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HLE-111-02-xx-DV-PE-LC, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight Samtec HPM power header series 3.81mm post length, 1x07, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header SMD 2x12 2.54mm double row Through hole angled pin header, 2x24, 1.00mm pitch, double rows Through hole angled pin header SMD 2x18 1.00mm double row surface-mounted straight pin header, 1x23, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled socket strip SMD 1x22 1.27mm single row Surface mounted socket strip THT 2x06 2.00mm double row surface-mounted straight socket strip, 1x02, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x23 2.54mm single row Through hole socket strip THT 2x05 2.00mm double row surface-mounted straight socket strip, 2x44, 1.27mm pitch, 4.0mm pin length, single row (from Kicad 4.0.7!), script generated Through hole pin header THT 1x08 5.08mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header, 2x12, 1.00mm pitch, single row Through hole straight pin header, 1x35, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm.

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