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TS *(optional) SIP socket, 2.54 mm, 1x10 Pin socket, 2.54 mm, 1x10 Pin socket, 2.54 mm, 1x2 (see [build notes](build.md)) | | | | S3 | 1 | SW_DPDT_x2 | Switch, dual pole triple throw, 3 position switch, SP3T K switch single-pole double-throw spdt ON-ON horizontal MEC 5G single pole double throw, separate symbols Quad Low-Noise JFET-Input Operational Amplifiers, DIP-14/SOIC-14 | | | S3 | 1 | 1 | B10k | **Potentiometer, 16 mm vertical board mount | | R3, R7 | 3 | 2_pin_Molex_header | KK254 Molex connector 2.54 mm 2x5 Standard switching diode, DO-35 | | | | | Tayda | A-1605 | | Tayda | A-826 | | | | | 4 | 100 nF | Unpolarized capacitor | | | | | | | R3, R21, R27, R28 | 3 | 1k | Resistor | | | | | Tayda | A-3588 | | | Tayda | A-804 | | | S3 | 1 Kosmo_panel | 2 Panels/futura medium bt.ttf // 13 SPDT switches 1 rotary switch with 12 positions D 2 rotary switch with LCD screen E3 SAxxxx switch normally-open pushbutton push-button D MEC 5G single pole normally-open illuminated tactile switch SPST angled PTS645VL58-2 LFS C&K Button tactile switch SPST right angle, http://www.ckswitches.com/media/1428/os.pdf 1x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST KingTek_DSHP02TS, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 6.7x21.88mm.

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