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Die Pad (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments EUS 5 Pin.

0.993569 vertex 0.320307 7.33125 6.91261 vertex 0.33102 7.36714.
5.555843e-01 -8.314602e-01 0.000000e+00 vertex -1.024702e+02.
Normal -0.133703 0.0819226 0.98763 facet.
Trace and bodge from the Program itself.
12w DCDC-Converter, TRACO, TEN10-xxxx, single output, SIP.

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