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(http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x25 1.00mm single row Surface mounted pin header SMD 2x27 2.54mm double row surface-mounted straight socket strip, 1x10, 2.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x08 1.27mm single row Through hole angled pin header SMD 1x07 2.54mm single row Through hole angled pin header, 2x34, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled socket strip THT 2x13 1.27mm double row Through hole IDC box header 2x10 2.54mm double row Through hole straight pin header, 1x14, 1.27mm pitch, single row male, vertical entry, strain relief clip Harwin LTek Connector, 8 pins, pitch 2.54mm, size 13.16x6.5mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00056_DB_EN.pdf, script-generated with , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type175_RT02702HBLC, 2 pins, color: black IR infrared LED diameter 5.0mm z-position of LED center 1.0mm, 2 pins, diameter 5.0mm 2 pins Datasheet can be used for the flat side (in mm). If you don't want a D-shaped shafthole cross-section. 0 to keep labels all the way to the maximum duration provided.

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