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[PATCH 02/18] Checkpoint after tweaking footprints some more, starting over at 14hp Checkpoint after fixes but before shrinking boards Checkpoint after re-centering sliders, before removing redundant LED resistors aa199fc6f4 Forget (and ignore) fp-info-cache file as it is based on https://www.analog.com/media/en/technical-documentation/data-sheets/199399fc.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.277x3.109mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x13, 2.00mm pitch, double rows Through hole angled pin header, e.g. For Wieson part number 2366C888-007 Molex 47053-1000, Foxconn HF27040-M1, Tyco 1470947-1 or equivalent, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header SMD 1x35 2.00mm single row style2 pin1 right Through hole straight socket strip, 1x03, 2.00mm pitch, single row Through hole straight pin header, 1x31, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header THT 1x14 1.00mm single row style2 pin1 right Through hole socket strip SMD 2x28 2.54mm double row Through hole angled pin header SMD 2x14 1.27mm double row Through hole socket strip SMD 1x38 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x13 2.00mm double row Through hole pin header SMD 2x23 2.00mm double row surface-mounted straight socket strip, 2x14, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x13 1.27mm single row style2 pin1 right Through hole pin header SMD 1x21 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x33 1.27mm single row Through hole angled pin header THT 2x30 2.54mm double row Through hole angled pin header SMD 1x13 2.00mm single row style2 pin1 right Through hole IDC box header THT 1x18 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 1x07, 2.00mm pitch, 6.35mm socket length, double rows Through hole straight socket strip, 2x39, 1.00mm pitch, double rows Surface mounted socket strip THT 1x29 2.00mm single row style1 pin1 left Surface mounted pin header.

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