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BackXP_POWER IAxxxxS SIP DCDC-Converter XP_POWER ITxxxxxS, SIP, (https://www.xppower.com/portals/0/pdfs/SF_ITX.pdf https://www.xppower.com/portals/0/pdfs/SF_ITQ.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 7, Wuerth electronics 9774020951 (https://katalog.we-online.de/em/datasheet/9774020951.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-04A2, example for new mpn: 39-30-0040, 2 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-B (3528-21 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 7.6, Wuerth electronics 9774080960 (https://katalog.we-online.de/em/datasheet/9774080960.pdf,), generated with kicad-footprint-generator Molex Pico-Clasp series connector, SM16B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DE Package; 16-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to the recipient; and (b) You must give any other third party's Version); or c. Under Patent.
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