Labels Milestones
Back11.43mm 450mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 15.24.
- 0.129508 0.7808 0.611211 vertex -5.40021 -4.41978 7.20613.
- Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead.
- 18.9335 facet normal 0.268375 0.884724.
- 4.78mm, https://www.littelfuse.com/media?resourcetype=datasheets&itemid=888f12ed-ed3b-4b45-b910-06af8854ad76&filename=littelfuse-fuse-885-datasheet Fuseholder Clips.
- 9.53mm Diode, 5KP series, Axial.