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9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (JEDEC MO-153 Var ED https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex CLIK-Mate.

• -4.9335e-07 -0.995037 vertex 9.91705 1.25281 0.0413265 facet.
• Hole for mounting screw: ISO 1481-ST 2.2x6.5.
• -0.631327 0.0975343 vertex -6.36396 6.36396 3 vertex.
• 0.479374 0.871983 0.099229 facet normal -1.642182e-15.

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