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Https://www.adafruit.com/product/2471 Arduino UNO R2, http://www.mouser.com/pdfdocs/Gravitech_Arduino_Nano3_0.pdf Arduino UNO R3, http://www.mouser.com/pdfdocs/Gravitech_Arduino_Nano3_0.pdf 8devices Carambola2, OpenWRT, industrial SoM computer, https://www.8devices.com/media/products/carambola2/downloads/carambola2-datasheet.pdf Pololu Breakout 16-pin 15.2x20.3mm 0.6x0.8\ Raspberry Pi Zero using through hole 4.5mm, height 2, Wuerth electronics 9775086960 (https://katalog.we-online.com/em/datasheet/9775086960.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 2.5, Wuerth electronics 97730606330 (https://katalog.we-online.com/em/datasheet/97730606330.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf#page=49), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.25 mm² wire, basic insulation, conductor diameter 1.25mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Texas WSON-6 DQK, http://www.ti.com/lit/ds/symlink/csd16301q2.pdf Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 3.623x3.651mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 44 leads; body width 4.4 mm; Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (https://ams.com/documents/20143/36005/AS7341_DS000504_3-00.pdf/#page=63 LGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-26S-0.5SH, 26 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST SHL series connector, DF3EA-05P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Capacitor SMD Kemet-B (3528-21 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 1.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-12S-0.5SH, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (https://ams.com/documents/20143/36005/AS7341_DS000504_3-00.pdf/#page=63 LGA, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-26DP-2DSA, 13 Pins per.

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