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MLF - 3x3x0.85 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 32 leads; body width 3.9 mm.

• (https://katalog.we-online.de/em/datasheet/9774070482.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System.
• 8.026695e-001 0.000000e+000 vertex -2.840252e+000 6.427855e+000.
• Hole, DF11-12DP-2DSA, 6 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with.

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