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2x47 1.27mm double row Through hole socket strip SMD 1x25 2.54mm single row Through hole angled pin header SMD 2x35 1.00mm double row surface-mounted straight socket strip, 2x02, 2.54mm pitch, double rows Through hole angled pin header, 1x02, 1.00mm pitch, 2.0mm pin length, double rows Through hole straight pin header, 2x01, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x31 2.00mm double row Through hole pin header THT 1x20 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x02 1.27mm single row Through hole angled pin header, 1x36, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled pin header SMD 2x37 1.27mm double row Through hole socket strip SMD 1x37 2.54mm single row Through hole straight Samtec HPM power header series 11.94mm post length, 1x12, 5.08mm pitch, single row Through hole IDC header, 2x12, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 2x17 2.00mm double row Through hole angled socket strip, 1x06, 1.00mm pitch, single row Through hole socket strip SMD 2x33 1.27mm double row surface-mounted straight socket strip, 2x33, 2.00mm pitch, single row male, vertical entry Harwin Female Vertical Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89008xx, 8 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator connector wire 0.1sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 2 times 2.5 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 8 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AA), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times 1 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TSSOP HTSSOP 0.65 thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=43), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 68 Pin (JEDEC MO-153 Var JB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153.

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