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BackNB-IoT module BC95 Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case TT1224 (https://ww2.minicircuits.com/case_style/TT1224.pdf) following land-pattern PL-258, including GND-vias (https://www.minicircuits.com/pcb/98-pl258.pdf Footprint for SSR made by Sharp Solid State relais SSR Sharp Sanyo SIP-15, 78.0mm x 8.0mm bosy size, STK-437E STK-439E STK-441E STK-443E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf 8-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; CASE 505AB (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x02 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x37 2.54mm single row style2 pin1 right Through hole socket strip SMD 2x23 2.54mm double row surface-mounted straight pin header, 2x14, 1.00mm pitch, 2.0mm pin length, single row Surface mounted pin header THT 2x17 2.54mm double row Through hole angled socket strip, 1x37, 2.00mm pitch, double rows Through hole IDC header, 2x15, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header THT 2x09 2.54mm double row Through hole angled socket strip, 2x38, 2.54mm pitch, 6mm pin length, single row male, vertical entry Harwin LTek Connector, 44 pins, surface mount SMD.
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