Labels Milestones
BackBody [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 44 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 10 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Piano, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body.
- Width 4mm, pitch 7.5mm size 54.8x14mm^2 drill 1.15mm.
- System, 5268-07A, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- -0.0823248 0.993251 vertex 5.59201 4.18951.
- Number: A-41791-0015 example for new part number: A-41792-0006.