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1
Back

Height package, https://www.ti.com/lit/ml/mpss034c/mpss034c.pdf, https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf USON, 14 Pin (http://www.ti.com/lit/ds/symlink/tlv9004.pdf#page=64), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2111.

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