Labels Milestones
BackBacdac34d7 Add more note files from the side echo("offsetToMountHoleCenterY: ", offsetToMountHoleCenterY); echo("offsetToMountHoleCenterY: ", offsetToMountHoleCenterY); echo("offsetToMountHoleCenterY: ", offsetToMountHoleCenterY); echo("offsetToMountHoleCenterY: ", offsetToMountHoleCenterX); module eurorackPanel(panelHp, mountHoles=2, hw = holeWidth, ignoreMountHoles=false //mountHoles ought to be fixed elsewhere ec67859b1c Start of LM13700 version to see why 744b72ef7e0d94fccfae99ec3cb3514981ac4616 2bd01a1ff2d30ca3cff647bbf3b80645437cc07c Add schematic, start on PCB with on-board antenna Class 2 Bluetooth Module without antenna Low-Power Long Range Transceiver Module Low Power Long Range Transceiver Module Low Power Long Range Transceiver Module THT-16 (https://www.hoperf.com/data/upload/portal/20181127/5bfcbea20e9ef.pdf Low Power Long Range Transceiver Module LoRa Radio, RF, Module, http://www.hoperf.com/upload/rf/RFM69HW-V1.3.pdf 8 pin SIM connector for PCB's with 40 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 30 contacts (polarized Highspeed card edge connector for PCB's with 20 contacts (not polarized Highspeed card edge connector for PCB's with 30 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 70 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 50 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (polarized Highspeed card edge connector for panel, 90° PCB mount 4 pin straight chassis connector Dual front isolated BNC plug (https://www.winconn.com/wp-content/uploads/364A2595.pdf Dual BNC Horizontal Isolated Subminiature Coaxial Switch 1.35mm High, DC to DC Converters dc-dc recom buck sip-3 pitch 2.54mm size 23.3x6.2mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00240, 10 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flatpack (MW) - 10x10x1.0 mm Body with Exposed Pad Variation BB; (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 32 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and.
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