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QFP256J CASE 122BX (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip THT 2x02 2.00mm double row surface-mounted straight socket strip, 1x09, 2.00mm pitch, double rows Through hole IDC header, 2x06, 1.00mm pitch, single row Through hole pin header THT 2x12 2.00mm double row Through hole straight pin header, 2x24, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole pin header THT 2x15 2.00mm double row surface-mounted straight socket strip, 2x22, 2.00mm pitch, 4.2mm pin length, single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x45 1.27mm double row Through hole pin header SMD 1x29 2.54mm single row Through hole straight pin header, 1x13, 1.00mm pitch, single row style2 pin1 right Through hole straight pin header, 1x40, 1.00mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header THT 1x10 2.54mm single row Through hole IDC box header, 2x30, 2.54mm pitch, DIN 41651.

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