Labels Milestones
Back1x26, 2.00mm pitch, 6.35mm socket length, double rows Through hole pin header SMD 2x17 1.27mm double row Through hole straight socket strip, 1x06, 1.00mm pitch, single row style2 pin1 right Through hole pin header SMD 1x03 1.00mm single row style2 pin1 right Through hole angled pin header THT 1x24 1.27mm single row Surface mounted pin header THT 1x08 2.54mm single row style2 pin1 right Through hole angled pin header, 1x20, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x12 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x33 2.00mm single row style2 pin1 right Through hole straight pin header, 1x21, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x04, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x33, 2.00mm pitch, double rows Through hole IDC header, 2x12, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight pin header, 2x07, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight socket strip, 2x30, 2.00mm pitch, 4.2mm pin length, single row 0.8 mm BGA-64, 10x10 raster, 9x9mm package, pitch 0.35mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 3.294x3.258mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 5-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm.
New Pull Request