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Size 10.8x26.96mm 10x-dip-switch SPST KingTek_DSHP10TJ, Slide, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 18-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 5x-dip-switch SPST Omron_A6S-510x, Slide, row spacing 5.9 mm (232 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD DIP Switch SPST Slide 8.61mm 338mil SMD SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.5mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 7x7mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable.

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