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Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 461, 4.63x4.15mm, 115.

• 6.17308 vertex -7.9145 -5.54857 3.25404 facet normal 0.533417.
• Two walls in parallel, close together.
• 0.0366054 0.152473 0.987629 facet.
• 16-Lead Lead Frame Chip Scale Package.
• 9.665134e+01 5.413272e+00 vertex -1.074403e+02 9.665134e+01 5.581992e+00.

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