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BackJing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901.
- Https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST Omron_A6H-2101.
- -0.180769 -0.981021 -0.0701403 vertex 7.86658 3.78936.
- Pitch 1.9mm 0.167W length 3.6mm.
- Size 25.4x9.8mm^2, drill diamater 1.3mm.