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Type101_RT01602HBWC, 2 pins, diameter 3.0mm, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-47XEC(Ver.9A).pdf LED Round FlatTop Rectangular size 5.0x2.0mm^2 z-position of LED center 1.6mm, 2 pins, pitch 10mm, size 105x9mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined VSON, 8 Pin (http://www.ti.com/lit/ds/symlink/iso1050.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 10.6, Wuerth electronics 9774020943 (https://katalog.we-online.de/em/datasheet/9774020943.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B20B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, SM10B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose series connector, B10B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated.

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