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Level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 0.65mm HSOP 11.0x15.9mm Pitch 0.65mm SSOP-8 2.95x2.8mm Pitch 0.65mm HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm 75ohm Relay, 1-Form-A, Schrack-RYII, RM5mm, SPST-NC Relay 1-Form-B Schrack-RYII RM5mm SPST-NO Relay, 1-Form-B, Schrack-RYII, RM5mm, SPST-NC Relay 1-Form-B Schrack-RYII RM5mm SPST-NO Relay, 1-Form-B, Schrack-RYII, RM5mm, SPST-NC Relay 1-Form-B Schrack-RYII RM5mm SPST-NO Relay, 1-Form-B, Schrack-RYII, RM5mm, SPST-NC Relay 1-Form-B Schrack-RYII RM5mm SPST-NO Relay, 1-Form-B, Schrack-RYII, RM5mm, SPST-NC Relay 1-Form-B Schrack-RYII RM5mm SPST-NO Relay, 1-Form-B, Schrack-RYII, RM5mm.

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