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300mil PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm.

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