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BackWLCSP-36, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP.
- DF52-2S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator.
- UFD Package, 4-Lead Plastic Small Outline Package.
- Href="https://gitea.circuitlocution.com/synth_mages/synth_tools/commit/5209c5fd76f5cb84bb09be3d7c836a3c6a5d5355">5209c5fd76f5cb84bb09be3d7c836a3c6a5d5355 Upload files to 'Panels' From.