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VerticalJackHoleSpacing + jackHoleDiameter / 2 + hole_diameter + hole_margin*2; side_margin = (board_width - hole_hdist) / 2; standoff_radius = hole_radius * 2.5; polygon([[0,0], [(board_width-insert_width)/2, -insert_depth], [board_width-(board_width-insert_width)/2, -insert_depth], [board_width, 0]]); 3D Printing/Panels/Radio_shaek_standoff.stl Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/PPTC_RXEF025.kicad_mod Normal file Unescape Schematics/SynthMages.pretty/eurorack_rail_hole.kicad_mod Normal file Unescape "Name": "Top Solder Mask" "Name": "Bottom Solder Paste" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" "Name": "Top Silk Screen" "Name": "Top Solder Paste" "Name": "Top Solder Paste" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" "Name": "Top Silk Screen" "Name": "Top Solder Paste" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Name": "Bottom Silk Screen" "Name": "Top Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file Unescape Hardware/PCB/precadsr_Gerbers/precadsr-F_Paste.gbr Normal file Unescape.

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