Labels Milestones
BackLeads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 14 leads; body width 4.4 mm; Exposed Pad Variation BB; (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506BU.PDF 8-Lead Plastic VSON, 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 3.357x3.657mm package, pitch 0.5mm; see section 6.1.
- Combination to be fixed elsewhere.
- U2-14 Case Out - 1K.
- 5268-02A, 2 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29.
- IEC 60603-13, double rows, 9.5mm latches, mounting holes.