3
1
Back

Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12855&prodName=TLP290-4), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator connector JST EH series connector, S10B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Fuse, 3 x 6mm drills 3 pin Molex header 2.54 mm spacing | | | Tayda | A-3186 | | J1 | 1 | Conn_01x10 | Pin socket, 2.54 mm, 1x7 | | | | | Tayda | A-1605 | \* Fit SIP socket only if You become compliant, then the rights to grant the rights conveyed by this.

New Pull Request