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0.65 exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049CH.pdf SC-74, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator connector Molex Micro-Fit_3.0 horizontal connector Molex Mini-Fit_Jr side entry JST SHL series connector, S24B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-18S-0.5SH, 18 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502443-0970 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, BM09B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 7.6, Wuerth electronics 9774100360 (https://katalog.we-online.de/em/datasheet/9774100360.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0610, with PCB trace layout created pull request 'Fix rail clearance = ~11.675mm, top and bottom railHeight = (threeUHeight-panelOuterHeight)/2; mountSurfaceHeight = (panelOuterHeight-panelInnerHeight-railHeight*2)/2; panelInnerOffset = (panelOuterHeight-panelInnerHeight)/2; echo("railHeight: ", railHeight); offsetToMountHoleCenterX = hp - holeOffset; // 1 for once/cont (sw15 // 2 NO Moment switches: // 1 for run/stop (sw14) // 1 for run/stop (sw14) // 1.

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