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Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP Switch SPST 1P1T CK components KMR2 tactile switch SPST angled PTS645VL58-2 LFS C&K Button tactile switch Light Touch Switch, http://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE3.pdf SMD SMT SPST EVQPUL EVQPUC SMD SMT 3.2x2.5mm, 6-pin QFN (https://www.sitime.com/datasheet/SiT9365.

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