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Back*.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file Unescape Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-MaskBottom.gbs Normal file Unescape.
- -1.51289e-06 facet normal -1.234240e-01 6.561230e-03 9.923323e-01.
- -0.45399 0 vertex 9.99456 -1.98804 2.19603.
- Normal -4.743276e-01 0.000000e+00 8.803484e-01 vertex -1.050340e+02 9.665134e+01.