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35.6x8.3mm^2, drill diamater 1.4mm, pad diameter 2.4mm, outer diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00245, 6 pins, pitch 5mm, size 72.3x14mm^2, drill diamater 1.3mm, pad diameter 2.8mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310111_RT055xxHBLC_OFF-022717S.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MKDS-1,5-6-5.08 pitch 5.08mm size 15.2x10.6mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type094_RT03502HBLU, 2 pins, diameter 5.0mm 3 pins U-DFN2510-10 package used by Diodes Incorporated PowerDI3333-8, Plastic Dual Flat, No Lead Package (UC) - 3x3x0.5 mm Body [QFN] with thermal vias; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901.

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