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(http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Molex Pico-SPOX Connector System, 43045-0400 (alternative finishes: 43045-100x), 5 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator JST SUR series connector, 502382-0670 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Micro Small Outline (SS)-5.30 mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TSSOP HTSSOP 0.65 thermal pad TSSOP HTSSOP 0.65 thermal pad HTSSOP32: plastic thin shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SO, 8 Pin (http://www.st.com/resource/en/datasheet/pm8834.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 22x22 grid.

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