Labels Milestones
BackFF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x04 2.54mm single row Through hole socket strip THT 1x25 1.27mm single row Through hole socket strip SMD 1x20 2.00mm single row Surface mounted socket strip THT 2x29 2.54mm double row Through hole straight pin header, 2x10, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x38 1.27mm double row Through hole.
- V 8.4645669 h 0.9448819 c 0,0 -0.050754,0.
- 8.032842e-001 facet normal -0.116009 -0.00017977.
- (100% rename MK_VCO_RADIO_SHAEK_try1.diy => Schematics/MK_VCO_RADIO_SHAEK_try1.diy.
- 14x7.6mm^2, drill diamater 1.3mm.