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SHT40, SHT41, SHT45, DFN, 4 Pin (https://sensirion.com/media/documents/33FD6951/624C4357/Datasheet_SHT4x.pdf LGA, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_20.pdf, CP-16-20), generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 4.5, Wuerth electronics 9774010982 (https://katalog.we-online.de/em/datasheet/9774010982.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-50S-0.5SH, 50 Pins (http://www.molex.com/pdm_docs/sd/5019204001_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WLCSP-35, 2.168x2.998mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 10x10mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf QFN, 48 Pin (http://ww1.microchip.com/downloads/en/devicedoc/00002117f.pdf#page=69), generated with kicad-footprint-generator JST PH series connector, DF52-15S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xx-DV-PE-LC, 40 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 28 Pin (JEDEC MO-241/VAB, https://assets.nexperia.com/documents/package-information/SOT763-1.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4180, 18 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0170, 17 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0301, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.

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