Labels Milestones
BackDFN, 4mm x 3mm MLF - 3x3x0.85 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON.
- Clone https://github.com/georgedorn/ttrss-plugin- _comics plugins/ _comics See init.php.
- 1.6x1.2mm^2 package SMD Crystal SERIES SMD2520/2 http://www.icbase.com/File/PDF/HKC/HKC00061008.pdf.
- ESIP-7C Vertical Flat Package with Heatsink.
- From 0c682bad950fdd2cbbdce033cf243faec76364d8 Mon Sep 17 00:00:00.