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Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT.

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