3
1
Back

5.45mm TO-264-3, Vertical, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Vertical RM 2.54mm TO-247-5, Horizontal, RM 1.27mm, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 1.7mm PentawattF- MultiwattF-5 staggered type-2 TO-220-4 Vertical RM 2.54mm TO-220F-4, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Horizontal RM 5.45mm TO-264-3, Vertical, RM 1.7mm, MultiwattF-11, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 5.45mm TO-264-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-2, Horizontal, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 5.45mm TO-247-3, Vertical, RM 1.7mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 10.9mm TO-247-3, Horizontal, RM 2.54mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 2.54mm IIPAK I2PAK TO-262-3, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias in pads, 5 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket.

New Pull Request