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BackWLCSP-81, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a box film cap for 100v is smaller, but not some kind of odd LFO. Current draw 12 mA +12 V, and sustain voltage is taken from \npot pin 1. Cmp-Mod V01 Created by Cvpcb (2015-03-25 BZR 5536)-product date = sam. 04 avril 2015 11:21:18 UTC update=Tue 20 Apr 2021 12:09:41 PM EDT Generated from schematic into main Reviewed-on: https://gitea.circuitlocution.com/synth_mages/MK_VCO/pulls/3 More schematics Schematics/Luthers_Perfboard.pdf | Bin 0 -> 579684 bytes .../Pot_Knobs/pot_knob_two_parts_base.stl | Bin 0 -> 46787 bytes Datasheets/tl074.pdf | Bin 11930 -> 0 bytes Images/precadsr-panel.png | Bin 0 -> 11692.
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