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Pins clear LED, Round, FlatTop, Rectangular size 3.3x2.4mm^2 diameter 1.8mm 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 1.0mm, 2 pins diameter 3.0mm z-position of LED center 9.0mm, 2 pins diameter 3.0mm z-position of LED center 2.0mm 2 pins THT ceramic resonator filter DSN6 Ceramic Resomator/Filter 7.0x2.5mm^2, length*width=7.0x2.5mm^2 package, package length=7.0mm, package width=2.5mm, 3 pins THT ceramic resonator filter CSTLSxxxX Ceramic Resomator/Filter 6.0x3.0mm^2, length*width=6.0x3.0mm^2 package, package length=7.0mm, package width=2.5mm, 2 pins LED, diameter 8.0mm, 3 pins THT ceramic resonator filter filter SMD Resomator/Filter Murata TPSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 6.9x2.9mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002CE https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 3.2x2.5mm^2 package crystal Epson Toyocom FA-238 series http://www.mouser.com/ds/2/137/1721499-465440.pdf, hand-soldering, 3.2x2.5mm^2 package SMD Crystal TXC 7A http://txccrystal.com/images/pdf/7a.pdf SMD Crystal EuroQuartz MQ2 series http://cdn-reichelt.de/documents/datenblatt/B400/MQ.pdf, hand-soldering, 7.0x5.0mm^2 package SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7.

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