synth_tools

Back

Bulkhead Molex SMA RF Connectors, Edge Mount, (http://www.molex.com/pdm_docs/sd/732512120_sd.pdf Connector SMA, 0Hz to 20GHz, 50Ohm, Edge Mount Universal Serial Bus (USB) Shielded I/O Plug, Type C, Right Angle, Surface Mount, Push-Pull Type, 1.42mm Height, with Detect Switch JST ACH series connector, B9B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST VH series connector, SM09B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 2.54mm staggered type-2 TO-220-4 Horizontal RM 2.286mm SIPAK Vertical RM 5.45mm TO-264-5, Horizontal, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Vertical RM 5.08mm TO-126-3, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-15, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-11, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 1.27mm staggered type-2 TO-220F-7 Vertical RM 5.08mm TO-126-3, Horizontal, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge 8.9mm 8.85mm WOB pitch 5.08mm length 16mm diameter 7.5mm Fastron MESC Inductor, Axial series, Axial, Horizontal, pin pitch=60mm, , length*diameter=55*35.0mm^2, Electrolytic Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/TANTAL-TB-Serie%23.pdf CP Radial_Tantal series Radial pin pitch 2.54mm DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, size 13.16x6.5mm^2, drill diamater 1.15mm, pad diameter 2.5mm, hole diameter 1.0mm THT pad as test Point, square 2.5mm side length SMD rectangular pad as test Point, diameter 2.0mm, 2 pins, diameter 5.0mm z-position of LED center.

New Pull Request

Labels Milestones