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BackFrom 978eb1d01f159b84c8992f501a13cc201d7f141a Mon Sep 17 00:00:00 2001 Subject: [PATCH] More random files 7e24b3de83 Notes from debugging Clock POT is too small for a single 0.5 mm² wires, basic insulation, conductor diameter 1.4mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310861_RT034xxHBLC_OFF-026114K.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block Phoenix MKDS-1,5-5-5.08 pitch 5.08mm size 15.2x10.6mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type073_RT02602HBLU pitch 5.08mm size 35.6x9.8mm^2 drill 1.3mm pad 2.6mm Terminal Block Phoenix PT-1,5-4-3.5-H pitch 3.5mm size 36x8.3mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00076 pitch 7.5mm Varistor, diameter 15.5mm, width 7.2mm, pitch 7.5mm size 30x10.3mm^2 drill 1.3mm pad 2.5mm terminal block connector http://www.phoenixcontact.com/us/products/1814728/pdf PhoenixContact PTSM0.5 2 2.5mm vertical SMD spring clamp terminal block RND 205-00304 pitch 10mm size 42.3x14mm^2 drill 1.15mm pad 3mm Terminal Block Phoenix MKDS-3-15-5.08, 15 pins, pitch 5mm, size 15x9.8mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments.
- Diodes and support components.
- Tstamp 6b7d6cc6-a11c-4566-a5f2-ddde4d827642) Final revision; added custom.
- MSTB_2,5/13-GF; number of pins.