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PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 12-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CN (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 44 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 10x-dip-switch SPST Copal_CHS-10B, Slide, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 8.61 mm (338 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 11x-dip-switch SPST , Slide, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST , Slide, row spacing 5.08 mm (200 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 5x-dip-switch SPST Omron_A6S-510x, Slide, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD DIP Switch SPST 1P1T CK components KMR2 tactile switch D reed switch, default-closed D SPDT reed switch K reed magnetic switch SPDT.

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