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Bin 36336 -> 0 bytes 6f5ee76aea tracks the ratsnest and compactifies the power subsystem Checkpoint after tweaking footprints some more, starting over at 14hp main synth_tools/3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_End_Female.stl Executable file View File 3D Printing/Panels/FIREBALL VCO.png Normal file View File main precadsr/Docs/precadsr_bom.md 59 lines Latest commits for file Panels/FireballSpell_Large.webp Images/PXL_20210831_000922493.jpg Normal file Unescape Hardware/Panel/precadsr_panel_al/sym-lib-table Normal file Unescape // pots (all p160s): // PWM duty attenuation /* [Default values] */ // Line segments for circles FN = 100; // [1:1:360] // Unit size (mm HP = 5.07; // 5.07 for a single 0.75 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-124-02-xxx-DV-BE-A, 24 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body [HTSSOP], with thermal vias; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Surface mounted pin header THT 2x28 1.27mm double row Through hole angled pin header, 2x16, 2.54mm pitch, 11.24mm row spacing, 12.6x8.3x4.1mm Autotransformer, Toroid, horizontal, laying, Diameter 12,5mm, Amidon T44, Autotransformer Toroid horizontal laying Diameter 9mm Amidon T30 Autotransformer, Toroid, horizontal, laying, Diameter 14mm, Amidon T50, Transformer Toroid horizontal laying Diameter 18mm Transformer, Toroid, tapped, horizontal, laying, 1 Tap, Diameter 12,5mm, Amidon T44, Transformer Toroid tapped horizontal laying Diameter 14mm Amidon T50 Transformer, Toroid, tapped, horizontal, laying, Diameter 18mm, Transformer Toroid horizontal laying Diameter 12 5mm Amidon T44 Choke, Inductance, Autotransformer, Toroid, horizontal, laying, Diameter 14mm, Amidon T50, Choke Inductance Autotransformer Toroid horizontal laying Diameter 18mm Transformer, Toroid, tapped, horizontal, laying, Diameter 10,5mm, Amidon, T37, Transformer Toroid.

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