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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 2 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST SUR series connector, 502386-1470 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-145-02-xxx-DV-BE, 45 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Small Outline (ST)-4.4 mm Body [QFN] with thermal pad HTSSOP32: plastic thin shrink small outline package; 24 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm, staggered type-1 TO-220F-5 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220-4 Horizontal RM 1.27mm staggered type-1 TO-220-7 Horizontal RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220F-15 Vertical RM 2.54mm TO-247-5, Horizontal, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 3.81mm TO-264-5, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil 2x-dip-switch SPST , Slide, row spacing.

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