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Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9.

• Hole 4.5mm, no annular m5 din965 Mounting Hole.
• -4.552437e-01 8.903669e-01 9.217512e-05 vertex -1.008355e+02 1.052120e+02 4.255000e+01 facet.

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