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RAM, Micro-SD, NAND or eMMC, 1000Mbit Ethernet A20 Olimex Olinuxino LIME2 development board Common footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 9x9mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 3.141x3.127mm package, pitch 0.35mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, pitch 0.65mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 pin, 4x4mm, 2.1mm sq pad (http://www.analog.com/media/en/technical-documentation/data-sheets/ADG633.pdf LFCSP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4001f.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Small Outline (SS)-5.30 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic DFN (6mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; No exposed pad TSSOP, 14 Pin.

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