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S4P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator connector Hirose DF11 through hole, DF13-08P-1.25DSA, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST SH series connector, 502494-1470 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-36DP-0.5V, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-02P-1.25DS, 2 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1430, 14 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 24 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Harting har-flexicon series connector, B4P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B02P-NV (http://www.jst-mfg.com/product/pdf/eng/eNV.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105314-xx14, 7 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/3-H-5.0 Terminal Block, 1732425 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732425), generated with kicad-footprint-generator ipc_noLead_generator.py LQFN, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf), generated with kicad-footprint-generator JST SUR series connector, S16B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST PH series connector, BM13B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf6025_en.pdf Inductor, TDK, SLF7045, 7.0mmx7.0mm (Script generated with kicad-footprint-generator Mounting Hardware, inside through hole Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 15.24 mm (600 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 9x-dip-switch SPST Omron_A6S-910x, Slide, row spacing 22.86 mm (900 mils), Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 9.53 mm (375 mils.

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